SKU: 42776126326
Ships within 48 hours · Estimated delivery Sep 6 - Sep 11
More complete and more stable
For Android: PH0O00 SL20 P2 Y0
Once iron reaches temperature (not too high
or resistors
Using a new type of magnetic power original positioning
MIJING Z22MAX Reballing Platform/Glue Removal for iPhone Android Screwdriver Tools More complete and more stableMIJING Z22 MAX multifunctional BGA reballing platform and glue removal station for precision CPU chip repair on iPhone 11 17 Pro Max and various Android phones, includes chip tinning soldering and IC adhesive removal functions. MIJING Z22MAX features a magnetic platform for securing BGA stencils and spring loaded locking mechanism that automatically adapt to various chip specifications such as iPhone CPU A13 A19 Pro, Qualcomm, MediaTek, Kirin, RAM
US$ 10240.00
US$ 55.00
US$ 249.97
US$ 11490.00
US$ 10.00
US$ 9240.00
US$ 9240.00
US$ 9740.00
